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13

Apr

A fulcrum to leverage the synergy of the computing power ecosystem

Charles Dickens said: "It was the best of times, it was the worst of times."If we were to give a more precise positioning to this era, it is the era of AI. The 2024 "Government Work Report" proposed: ...
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tech

01

Apr

Huating Technology, a giant on the offensive

In the book "Huawei Supply Chain Management," it was revealed: "Currently, Huawei's self-produced volume is only about 10%, and 90% is completed by outsourcing factories, including Original Equipment ...
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tech

30

Mar

Three departments: Optimize and adjust drone export control measures, which will

Export controls on certain consumer drones are relaxed, while controls on dual-use payloads are tightened.The Ministry of Commerce, General Administration of Customs, and the Central Military Commissi...
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tech

22

Mar

Domestic high-end car intelligent driving chip triggers a war of words

On July 27th, at the 2024 NIO Innovation Technology Day, NIO Automobile's chairman Li Bin announced that the world's first automotive-grade 5nm intelligent driving chip, the Shengyuan NX9031, has succ...
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tech

20

Mar

$5.9 billion! Renesas Electronics completes the acquisition of PCB design softwa

Altium had previously rejected a $3.9 billion acquisition offer from software company Autodesk in 2021, citing the price as too low.Renowned Japanese electronics company Renesas Electronics has comple...
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tech

17

Mar

The era of 1000-layer 3D NAND Flash is coming

Lam Research Introduces Cryogenic Etching Technology, Paving the Way for 1000-Layer 3D NAND.Lam Research has launched Lam Cryo 3.0, the company's third-generation production-proven cryogenic dielectri...
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  • The key to the next generation of chips: innovation in chip interconnect technol
  • Intel VS Samsung VS TSMC, the situation is intensifying
  • $5.9 billion! Renesas Electronics completes the acquisition of PCB design softwa
  • Who is building the 100,000 GPU clusters for xAI?
  • Domestic high-end car intelligent driving chip triggers a war of words
  • GlobalWafers announces a $400 million U.S. subsidy, and will produce the most ad
  • What is GigaDevice's answer on automotive storage and MCU?
  • How to plan chip layout in the Chiplet era
  • Unified standards for advanced packaging, which of the three chip giants will ag
  • Changes in the sale of LGD's Guangzhou 8.5th generation line
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